MediaTek on Tuesday announced the Dimensity 8100, Dimensity 8000, and Dimensity 1300 system-on-chips (SoCs) to bring flagship grade performance for premium 5G smartphones.
Both Dimensity 8100 and 8000 chipsets use 5nm process with octa-core CPU that integrate four Arm Cortex-A78 cores and four Cortex-A55 efficiency cores with speeds operating up to 2.85GHz, and 2.75GHz respectively.
The said chips sports Arm Mali-G610 MC6 GPU with MediaTek’s HyperEngine 5.0 gaming technologies for improved power efficiency that extends playtime and frame rate stability—up to 170 fps for the Dimensity 8100 and 140 fps for the Dimensity 8000. Memory support comes with LPDDR5 and UFS 3.1.
The Dimensity 8000 series also integrates fifth-generation AI Processing Unit, APU 580 aiming balance toward performance and power efficiency. These chips also have a five gigapixel per second image signal processor (ISP) for fastest, clearest HDR photos and video in its class.
MediaTek claims that Dimensity 8000 series borrowed similar technology from their Dimensity 9000 flagship chip. “You could say the MediaTek Dimensity 8000 series is the little brother to our flagship Dimensity 9000 chip. Meaning it brings flagship-grade features and next-level energy efficiency to the premium smartphone market,” said CH Chen, Deputy General Manager of MediaTek’s Wireless Communications Business Unit.
Other features of Dimensity 8000 series include:
- Support for up to 200MP cameras and 4K60 HDR10+ videography.
- MediaTek’s latest noise reduction and AI-based unblur techniques in extreme low-light environments for crisp shots with enhanced details.
- Simultaneous dual camera HDR video recording. Users can record with the front and rear cameras or two different rear lenses – for example, wide + tele – at the same time.
- Leading 3GPP R16-ready 5G modem to boost sub-6GHz performance using 2CC Carrier Aggregation.
- MediaTek’s 5G UltraSave 2.0 power-saving enhancement suite for improved efficiency.
- Support for Wi-Fi 6E and Bluetooth 5.3 for seamless coexistence of Wi-Fi connectivity and Bluetooth peripherals.
Additionally, the MediaTek Dimensity 1300 runs on 6nm process with octa-core CPU that integrates an ultra-core Arm Cortex-A78 clocked up to 3GHz, three Arm Cortex-A78 super cores and four Arm Cortex-A55 efficiency cores, along with an Arm Mali-G77 GPU and MediaTek APU 3.0 to support the latest AI capabilities.
Dimensity 1300’s HDR-ISP supports up to 200 megapixel per second and integrates MediaTek’s HyperEngine 5.0.
MediaTek’s Dimensity 8100, Dimensity 8000 and Dimensity 1300 powered smartphones will be available in the market on the first quarter of 2022.
source: MediaTek Press Release
Source: Yugatech
Hello, my name is Jack Sparrow. I'm a 50 year old self-employed Pirate from the Caribbean.
No comments:
Post a Comment