AMD is releasing the budget-friendly Zen 2 based Ryzen 3 desktop CPUs and motherboards with the B550 chipset in the coming months.
Compared to the Ryzen 3 series from the Zen and Zen+ architecture, the new Ryzen 3 3100 and 3300X comes with Simultaneous Multi-Threading enabled, for a total of four cores and eight threads. Both chips have a 65W TDP with a total cache of 18MB. The Ryzen 3 3100 has a 3.6GHz base and 3.9GHz boost frequency, while the 3300X has a 3.8GHz base and 4.3GHz boost.
A few weeks after the release of the Ryzen 3 processors, ODM partners would release the B550 motherboards. Motherboards using the B550 chipset are more affordable than the top-of-the-line X570 motherboards but are still compatible with the faster PCIe Gen 4.
The Ryzen 3 3100 and 3300X CPUs are expected to be available in retailers worldwide starting May 21, 2020, for USD 99 and USD 120, respectively. The PCIe Gen 4-ready B550 motherboards, on the other hand, are expected to be released by June 16, 2020, from board partners such as ASRock, ASUS, Biostar, Colorful, Gigabyte, and MSI.
Stay tuned for local availability and prices.
The post AMD to release latest Ryzen 3 series and B550 motherboards appeared first on YugaTech | Philippines Tech News & Reviews.
Source: Yugatech
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